头像

Yangyang Guan

School of Electronics & Information?

Post:

GraduateSchool Beijing University of Posts and Telecommunications
Email: yanggy@hdu.edu.cn
OfficeLocation:
Phone:

10 Access

Resume

 Yangyang Guan received her B.Sc. degree in Electronic Engineering from Chongqing University of Posts and Telecommunications (CQUPT), Chongqing, China in 2014 and the Ph.D. degree in Electronic Engineering from the Beijing University of Posts and Telecommunications (BUPT),Beijing, China in 2020.

  During February, 2018 to February, 2019, she was a joint PhD. student at the Georgia Institute of Technology, Atlanta, USA. In 2020, she joined the Hangzhou Dianzi University (HDU) and is currently a lecturer with the School of Electronics and Information, HDU. Her research interests include microwave power amplifiers, low noise amplifiers, power dividers, antennas and filters design.

Education
Work Experience
Social Position
Research Field
Courses
Open Course
Patent
Publications

[1]    Y. Guan, Y. Wu and M. M. Tentzeris, “A Bidirectional Absorptive Common-Mode Filter Based on Interdigitated Microstrip Coupled Lines for 5G “Green” Communications,” IEEE Access, vol. 8, no. 1, pp. 20759-20769, 23 Jan. 2020.

[2]    Y. Guan, Y. Wu, M. Li, W. Wang and Y. Liu, “Generalised MIT in a Tri-band LNA,” IET Microwave, Antenna & Propagation, vol. 11, no. 2, pp. 294-302, 29 Jan. 2017.

[3]    Y. Wu, Y. Guan, Z. Zhuang, W. Wang and Y. Liu, “A Novel Tri-band T-junction Impedance-transforming Power Divider with Independent Power Division Ratios,” PLoS ONE, vol. 12, no. 6, 6 Jun. 2017.

[4]    Y. Guan, Y. Wu, X. Zhang, and Y. Liu, “A Novel Wide-range Continuously-tuneable Varactor-based Matching Network for Low-noise Amplifiers,” HKIE Transactions, vol. 23, no. 1, pp. 12-18, 2 Jan. 2016.

[5]    Y. Guan, S. Wang, Manos M. Tentzeris, and Y. Liu, “A Microfluidic Spherical Helix Module Using Liquid Metal and Additive Manufacturing for Drug Delivery Applications,” 2019 IEEE MTT-S International Microwave Symposium (IMS2019) in Boston, Massachusetts, USA, on June 2-7, pp. 1446-1449, 2019.

Patent
Books
Patent
Honor and Award
Software Copyright