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Wen-Sheng Zhao

Ph.D. Professor | Doctoral Advisor Discipline: Post:

Graduate School: Zhejiang University

Research direction:

Email: wshzhao@hdu.edu.cn

Address: Rm 106, Bldg 4

Mobile phone access

Wen-Sheng Zhao received the B.E. degree from Harbin Institute of Technology, Harbin, China, in 2008, and the Ph.D. degree from Zhejiang University, Hangzhou, China, in 2013. During his Ph.D. study, he visited the National University of Singapore, Singapore, from 2010 to 2013. 


Since August 2013, he has been with Hangzhou Dianzi University, where he is currently a full professor. He was a visiting scholar at Georgia Institute of Technology, Atlanta, USA, from 2017 to 2018. His current research interests include integrated microsystems (multiphysics, signal integrity, and machine learning applications, etc.) and microwave components and circuits (microwave sensors, FSS, etc.).


Dr. Zhao is a senior member of IEEE and CIE, and serves as an Associate Editor for IEEE Access and Microelectronics Journal, and a Guest Editor of Micromachines and Electronics. He received Outstanding Associate Editor from IEEE Access, the Young Scientist Award from IEEE ICET in 2022, and the Student Best Paper Award from IEEE EDAPS in 2015. 



Longitudinal research
Transverse scientific research
Publications

Wen-Sheng Zhao, Wen-Yan Yin, Xiao-Peng Wang, and Xiao-Long Xu, Frequency- and temperature-dependent modeling of coaxial through-silicon vias for 3-D ICs, IEEE Transactions on Electron Devices, vol. 58, no. 10, pp. 3358-3368, October 2011

Jiang-Peng Cui, Wen-Sheng Zhao, Wen-Yan Yin, and Jun Hu, Signal transmission analysis of multilayer graphene nano-ribbon (MLGNR) interconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 1, pp. 126-132, February 2012

Wen-Sheng Zhao, Wen-Yan Yin, and Yong-Xin Guo, Electromagnetic compatibility-oriented study on through silicon single-walled carbon nanotube bundle via (TS-SWCNTBV) arrays, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 1, pp. 149-157, February 2012

Yun-Fan Liu, Wen-Sheng Zhao*, Zheng Yong, Yuan Fang, and Wen-Yan Yin*, Electrical modeling of three-dimensional carbon-based heterogeneous interconnects, IEEE Transactions on Nanotechnology, vol. 13, no. 3, pp. 488-495, May 2014

Wen-Sheng Zhao and Wen-Yan Yin, Comparative study on multilayer graphene nanoribbon (MLGNR) interconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 3, pp. 638-645, June 2014

Wen-Sheng Zhao, Da-Wei Wang, Gaofeng Wang, and Wen-Yan Yin, Electrical modeling of on-chip Cu-graphene heterogeneous interconnects, IEEE Electron Device Letters, vol. 36, no. 1, pp. 74-76, January 2015

Xu-Chen Wang, Wen-Sheng Zhao*, Jun Hu, and Wen-Yan Yin*, Reconfigurable terahertz leaky-wave antenna using graphene-based high-impedance surface, IEEE Transactions on Nanotechnology, vol. 14, no. 1, pp. 62-69, January 2015

Rui Zhang, Wen-Sheng Zhao, Jun Hu, and Wen-Yan Yin, Electrothermal characterization of multilevel Cu-graphene heterogeneous interconnects in the presence of an electrostatic discharge (ESD), IEEE Transactions on Nanotechnology, vol. 14, no. 2, pp. 205-209, March 2015

Da-Wei Wang, Wen-Sheng Zhao*, Xiao-Qiang Gu, Wenchao Chen, and Wen-Yan Yin*, Wideband modeling of graphene-based structures at different temperatures using hybrid FDTD method, IEEE Transactions on Nanotechnology, vol. 14, no. 2, pp. 250-258, March 2015

Wen-Sheng Zhao, Jie Zheng, Feng Liang, Kuiwen Xu, Xi Chen, and Gaofeng Wang, Wideband modeling and characterization of differential through-silicon vias for 3-D ICs, IEEE Transactions on Electron Devices, vol. 63, no. 3, pp. 1168-1175, March 2016

Na Li, Junfa Mao, Wen-Sheng Zhao, Min Tang, Wenchao Chen, and Wen-Yan Yin, Electrothermal cosimulation of 3-D carbon-based heterogeneous interconnects, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no, 4, pp. 518-526, April 2016

Wen-Sheng Zhao, Jie Zheng, Yue Hu, Shilei Sun, Gaofeng Wang, Linxi Dong, Liyang Yu, Lingling Sun, and Wen-Yan Yin, High-frequency analysis of Cu-carbon nanotube composite through-silicon vias, IEEE Transactions on Nanotechnology, vol. 15, no. 3, pp. 506-511, May 2016

Wen-Sheng Zhao, Jie Zheng, Linxi Dong, Feng Liang, Yue Hu, Luwen Wang, Gaofeng Wang, and Qifa Zhou, High-frequency modeling of on-chip coupled carbon nanotube interconnects for millimeter-wave applications, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 8, pp. 1226-1232, August 2016

Wen-Sheng Zhao, Jie Zheng, Shichang Chen, Xiang Wang, and Gaofeng Wang, Transient analysis of through-silicon vias in floating silicon substrate, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 1, pp. 207-216, February 2017

Alessandro Giuseppe D'Aloia, Wen-Sheng Zhao, Gaofeng Wang, and Wen-Yan Yin, Near-field radiated from carbon nanotube and graphene-based nanointerconnects, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 2, pp. 646-653, April 2017

Wen-Sheng Zhao, Jie Zheng, Jing Wang, Feng Liang, Fei Wen, Linxi Dong, Dingwen Wang, and Gaofeng Wang, Modeling and characterization of coaxial through-silicon via with electrical floating inner silicon, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 6, pp. 936-943, June 2017

Zi-Han Cheng, Wen-Sheng Zhao*, Linxi Dong, Jing Wang, Peng Zhao, Haijun Gao, and Gaofeng Wang*, Investigation of copper-carbon nanotube composites as global VLSI interconnects, IEEE Transactions on Nanotechnology, vol. 16, no. 6, pp. 891-900, November 2017

Da-Wei Wang, Wen-Sheng Zhao, Hao Xie, Jun Hu, Liang Zhou, Wenchao Chen, Pingqi Gao, Jichun Ye, Yang Xu, Hong-Sheng Chen, Er-Ping Li, and Wen-Yan Yin, Tunable THz multiband frequency-selective surface based on hybrid metal-graphene structures, IEEE Transactions on Nanotechnology, vol. 16, no. 6, pp. 1132-1137, November 2017

Jing Jin, Wen-Sheng Zhao, Da-Wei Wang, Hong-Sheng Chen, Er-Ping Li, and Wen-Yan Yin, Investigation of carbon nanotube-based through-silicon vias for PDN applications, IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 3, pp. 738-746, June 2018

Wen-Sheng Zhao, Zi-Han Cheng, Jing Wang, Kai Fu, Da-Wei Wang, Peng Zhao, Gaofeng Wang, and Linxi Dong, Vertical graphene nanoribbon interconnects at the end of the roadmap, IEEE Transactions on Electron Devices, vol. 65, no. 6, pp. 2632-2637, June 2018

Kai Fu, Wen-Sheng Zhao*, Gaofeng Wang, and Madhavan Swaminathan, A passive equalizer design for shielded differential through-silicon vias in 3-D ICs, IEEE Microwave and Wireless Components Letters, vol. 28, no. 9, pp. 768-770, September 2018

Na Li, Junfa Mao, Wen-Sheng Zhao, Min Tang, and Wen-Yan Yin, High-frequency electrothermal characterization of TSV-based power delivery network, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 12, pp. 2171-2179, December 2018

Da-Wei Wang, Wen-Sheng Zhao*, Wenchao Chen, Guodong Zhu, Hao Xie, Pingqi Gao, and Wen-Yan Yin*, Parallel simulation of fully coupled electrothermal processes in large-scale phase-change memory arrays, IEEE Transactions on Electron Devices, vol. 66, no. 2, pp. 5117-5125, December 2019

Li-Chao Fan, Wen-Sheng Zhao*, Hong-Yi Gan, Li He, Qi Liu, Linxi Dong, and Gaofeng Wang, A high-Q active substrate integrated waveguide based sensor for fully characterizing magneto-dielectric (MD) materials, Sensors and Actuators A: Physical, vol. 301, p. 111778, January 2020

Hong-Yi Gan, Wen-Sheng Zhao*, Li He, Yufeng Yu, Kuiwen Xu, Fei Wen, Linxi Dong, and Gaofeng Wang, A CSRR-loaded planar sensor for simultaneously measuring permittivity and permeability, IEEE Microwave and Wireless Components Letters, vol. 30, no. 2, pp. 219-221, February 2020

Qing-Hao Hu, Wen-Sheng Zhao*, Kai Fu, and Gaofeng Wang, Modeling and characterization of differential multibit carbon-nanotube through-silicon vias, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 2, pp. 534-537, March 2020

Hong-Yi Gan, Wen-Sheng Zhao*, Qi Liu, Da-Wei Wang, Linxi Dong, Gaofeng Wang*, and Wen-Yan Yin, Differential microwave microfluidic sensor based on microstrip complementary split-ring resonator (MCSRR) structure, IEEE Sensors Journal, vol. 20, no. 11, pp. 5876-5884, June 2020

Wen-Sheng Zhao, Qing-Hao Hu, Yuan-Yuan Zhang, Da-Wei Wang, Jing Wang, Yue Hu, and Gaofeng Wang, Modeling of carbon nanotube-based differential through-silicon vias in 3-D ICs, IEEE Transactions on Nanotechnology, vol. 19, pp. 492-499, July 2020

Li-Chao Fan, Wen-Sheng Zhao*, Da-Wei Wang, Shichang Chen, and Gaofeng Wang, An ultrahigh sensitivity microwave sensor for microfluidic applications, IEEE Microwave and Wireless Components Letters, vol. 30, no. 12, pp. 1201-1204, December 2020

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, Ultrahigh-sensitivity microwave microfluidic sensors based on modified complementary electric-LC and split-ring resonator structures, IEEE Sensors Journal, vol. 21, no. 17, pp. 18756-18763, September 2021

Bin-Xiao Wang, Wen-Sheng Zhao*, Da-Wei Wang, Wen-Jing Wu, Qi Liu, and Gaofeng Wang, Sensitivity optimization of differential microwave sensors for microfluidic applications, Sensors and Actuators A: Physical, vol. 330, p. 112866, October 2021

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, A temperature-compensated differential microstrip sensor for microfluidic applications, IEEE Sensors Journal, vol. 21, no. 21, pp. 24075-24083, November 2021

Da-Wei Wang, Wen-Sheng Zhao*, Zheng-Min Zhang, Qi Liu, Hao Xie, Wenchao Chen, Wen-Yan Yin, and Gaofeng Wang, A hybrid streamline upwind finite volume-finite element method for semiconductor continuity equations, IEEE Transactions on Electron Devices, vol. 68, no. 11, pp. 5421-5429, November 2021

Bin-Xiao Wang, Wen-Sheng Zhao*, Da-Wei Wang, Junchao Wang, Wenjun Li, and Jun Liu, Optimal design of planar microwave microfluidic sensors based on deep reinforcement learning, IEEE Sensors Journal, vol. 21, no. 24, pp. 27441-27449, December 2021

Peng-Wei Zhu, Xiang Wang*, Wen-Sheng Zhao*, Jing Wang*, Da-Wei Wang, Fang Hou, and Gaofeng Wang, Design of H-shaped planar displacement microwave sensors with wide dynamic range, Sensors and Actuators A: Physical, vol. 333, p. 113311, January 2022

Yu-Hao Fang, Wen-Sheng Zhao*, Fu-Kang Lin, Da-Wei Wang, Junchao Wang, and Wen-Jing Wu, An AMC-based liquid sensor optimized by particle-ant colony optimization algorithms, IEEE Sensors Journal, vol. 22, no. 3, pp. 2083-2090, February 2022

Wen-Sheng Zhao, Bin-Xiao Wang, Da-Wei Wang, Bin You, Qi Liu, and Gaofeng Wang, Swarm intelligence algorithm-based optimal design of microwave microfluidic sensors, IEEE Transactions on Industrial Electronics, vol. 69, no. 2, pp. 2077-2087, February 2022

Hao Xu, Wen-Sheng Zhao*, Da-Wei Wang, and Jun Liu, Compact folded SSPP transmission line and its applications in low-pass filters, IEEE Photonics Technology Letters, vol. 34, no. 11, pp. 591-594, June 2022

Hao Xu, Wen-Sheng Zhao*, Wen-Jing Wu, Da-Wei Wang, Haijun Gao, Yue Hu, and Jun Liu, Miniaturized microwave microfluidic sensor based on quarter-mode 2.5-D spoof plasmons, Sensors and Actuators A: Physical, vol. 342, p. 113621, August 2022

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, An active microfluidic sensor based on slow-wave substrate integrated waveguide for measuring complex permittivity of liquids, Sensors and Actuators A: Physical, vol. 344, p. 113699, September 2022

Wen-Jing Wu, Wen-Sheng Zhao*, and Gaofeng Wang*, A dielectric sensor based on differential microstrip lines coupled with multiple magnetic-LC resonators, IEEE Sensors Journal, vol. 22, no. 20, pp. 19327-19335, October 2022

Wen-Jing Wu and Wen-Sheng Zhao*, A quality factor enhanced microwave sensor based on modified split-ring resonator for microfluidic applications, IEEE Sensors Journal, vol. 22, no. 23, pp. 22582-22590, December 2022

Jian-Hong Fu, Wen-Jing Wu, Da-Wei Wang, and Wen-Sheng Zhao*, High-sensitivity microfluidic sensor based on quarter-mode interdigitated spoof plasmons, IEEE Sensors Journal, vol. 22, no. 24, pp. 23888-23895, December 2022

Yi-Hao Ma, Da-Wei Wang*, Yufeng Yu, and Wen-Sheng Zhao*, Design of dual-band frequency-selective surfaces with independent tunability, IEEE Transactions on Antennas and Propagation, vol. 70, no. 12, pp. 12381-12386, December 2022

Wen-Jing Wu, Wen-Sheng Zhao*, Da-Wei Wang, Bo Yuan, and Gaofeng Wang*, A dual-mode microstrip sensor for simultaneously extracting complex permittivity and permeability of magnetodielectric samples, Sensors and Actuators A: Physical, vol. 349, p. 11400, January 2023

Zeng-Cai Zhang, Fang Hou, Da-Wei Wang, Jun Liu, and Wen-Sheng Zhao*, PSO-algorithm-assisted design of compact SSPP transmission line, IEEE Microwave and Wireless Technology Letters, vol. 33, no. 3, pp. 247-250, March 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A differential THz/MW sensor for characterizing liquid samples based on CSRs, IEEE Sensors Journal, vol. 23, no. 10, pp. 10429-10436, May 2023

Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao*, Bin You, Jun Liu, Cheng Qian, and Hong-Bo Xu, Intelligent design and tunning method for embedded thermoelectric cooler (TEC) in 3D integrated microsystems, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 788-797, June 2023

Peng Zhang, Da-Wei Wang*, and Wen-Sheng Zhao*, Investigation on embedded microchannel heatsink for 2.5D integrated package, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 838-848, June 2023

Wei Ye, Da-Wei Wang, Jing Wang, Shichang Chen, Gaofeng Wang, and Wen-Sheng Zhao*, An ultrahigh-sensitivity dual-mode microwave sensor for microfluidic applications, IEEE Microwave and Wireless Technology Letters, vol. 33, no. 7, pp. 1082-1084, July 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A differential microwave sensor loaded with magnetic-LC resonators for simultaneous thickness and permittivity measurement of material under test by odd- and even-mode, IEEE Sensors Journal, vol. 23, no. 12, pp. 12808-12816, June 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A modified MLC-based microwave sensing system for retrieving permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 15, pp. 16805-16813, August 2023

Wen-Jing Wu and Wen-Sheng Zhao*, Microwave measurement system for characterizing liquid samples based on a modified HMSIW, IEEE Sensors Journal, vol. 23, no. 19, pp. 22466-22475, October 2023

Jian-Hong Fu, Wen-Jing Wu, Hao Xu, and Wen-Sheng Zhao*, A differential active SLSP-based microwave sensor for liquid characterization, IEEE Sensors Journal, vol. 23, no. 20, pp. 24420-24427, October 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A microwave sensor system based on oscillating technique for characterizing complex permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 21, pp. 25958-25970, November 2023

Wen-Jing Wu and Wen-Sheng Zhao*, A microwave sensor based on frequency-locked-loop and multiple complementary split-ring resonators for retrieving complex permittivity of liquid samples, IEEE Sensors Journal, vol. 23, no. 24, pp. 30345-30359, December 2023

Da-Wei Wang, Jia-He Zhu, Yi-Fan Liu, Gaofeng Wang, and Wen-Sheng Zhao*, Modeling and simulation of RRAM with carbon nanotube electrode, IEEE Transactions on Nanotechnology, vol. 23, pp. 1-8, January 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel differential microwave sensor based on reflective-mode phase-variation of stepped-impedance transmission lines for extracting permittivity of dielectric materials, IEEE Sensors Journal, vol. 24, no. 3, pp. 2746-2757, February 2024

Qi Qiang Liu, Wen-Sheng Zhao*, Huan Wang, and Naixing Feng*, 3-D domain decomposition method with nonconformal meshes for thermoelastic modeling, IEEE Geoscience and Remote Sensing Letters, vol. 21, p. 7502105, February 2024

Hao Xu, Wen-Jing Wu, Wen-Sheng Zhao*, Wenxuan Tang, and Lingling Sun, Ultrasensitive edible oil sensor based on spiral SLSP combined with stepped structure, IEEE Transactions on Instrumentation and Measurement, vol. 73, p. 6003209, February 2024

Yi-Hao Ma, Yu-Bin Chen, Qi-Qiang Liu, and Wen-Sheng Zhao*, Design of absorptive common-mode filters based on coupled stripline λ/4 resonator, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 4, pp. 649-658, April 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel microwave sensor based on modified rat-race coupler for extracting real permittivity and concentration of binary aqueous solution, IEEE Sensors Journal, vol. 24, no. 9, pp. 14213-14228, May 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A novel microwave sensor system based on feedback-type oscillator and modified coplanar waveguide resonator for retrieving complex permittivity of liquid samples, IEEE Sensors Journal, vol. 24, no. 13, pp. 20571-20586, July 2024

Yi-Fan Deng, Yi-Hao Ma, Da-Wei Wang, Xiang Wang*, Wenjun Li*, and Wen-Sheng Zhao*, An absorptive common-mode suppression filter based on resistor-loaded M-type structure, IEEE Transactions on Circuits and Systems II: Express Brief, vol. 71, no. 7, pp. 3483-3487, July 2024

Yi-Fan Liu, Da-Wei Wang*, Zhe-Kang Dong, Hao Xie, and Wen-Sheng Zhao*, Implementation of multiple-step quantized STDP based on novel memristive synapses, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 32, no. 8, pp. 1369-1379, August 2024

Yufeng Yu, Wen-Jing Wu*, Wen-Sheng Zhao*, and Wensong Wang, Feedback-type RF oscillator and modified magnetic-LC resonator based microwave sensing system for characterizing liquid samples,. IEEE Sensors Journal, vol. 24, no. 17, pp. 27465-27479, September 2024

Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A Microwave Sensing System Combination of Interdigital Structure (IDS)-Based Microstrip Line and RF Circuits for Extracting Complex Permittivity of Liquid Samples, Sensors and Actuators: A. Physical, vol. 378, p. 115860, September 2024

Wen-Jing Wu, Lina Shang*, Wen-Sheng Zhao*, and Wensong Wang, Fluidic glucose measurement based on a differential microwave sensing system with combination of multistepped-impedance transmission lines, IEEE Sensors Journal, vol. 24, no. 18, pp. 28805-28817, September 2024

Jian-Hong Fu, Wen-Jing Wu*, Qi Qiang Liu*, and Wen-Sheng Zhao*, Microwave microfluidic sensor based on spoof localized surface plasmons for monitoring lubricating oil quality, IEEE Microwave and Wireless Technology Letters, vol. 34, no. 11, pp. 1305-1308, November 2024

Jia-Hao Pan, Wen-Jing Wu*, Qiqiang Liu, Wen-Sheng Zhao*, Da-Wei Wang, Xiao-Ping Hu, Yue Hu*, Jing Wang, Jun Liu, and Lingling Sun, Deep reinforcement learning based optimization of microwave microfluidic sensor, IEEE Microwave and Wireless Technology Letters, vol. 34, no. 11, pp. 1309-1312, November 2024

Cheng-Yi Feng, Peng Zhang*, Da-Wei Wang, Wen-Sheng Zhao*, Jing Wang, and Paul Christodoulides*, Hybrid neural network based multi-objective optimal design of hybrid pin-fin microchannel heatsink for integrated microsystems, International Communications in Heat and Mass Transfer, vol. 159, Part B, p. 108137, December 2024

Jia-Hao Pan, Wen-Jing Wu, Qiqiang Liu, Wen-Sheng Zhao*, Da-Wei Wang, Xiao-Ping Hu, Jun Liu, and Lingling Sun, Ultrahigh sensitivity microwave liquid sensor based on 3D comb-shaped capacitive structures, IEEE Sensors Journal, vol. 24, no. 23, pp. 38970-38978, December 2024

Wen-Jing Wu, Hao Xie*, Wen-Sheng Zhao*, and Wensong Wang, A microwave sensor system based on M-SRRs for assessing the complex permittivity of liquid samples, IEEE Sensors Journal, vol. 24, no. 24, pp. 40827-40838, December 2024

Cheng-Pan Huang, Yi-Hao Ma, Qi-Qiang Liu, Wen-Sheng Zhao*, Xiang Wang, Cheng-Hao Yu, and Da-Wei Wang, PPO algorithm-assisted design of absorptive common-mode suppression filters, IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 6, pp. 2039-2047, December 2024

Chang-Sheng Mao, Da-Wei Wang, Wen-Sheng Zhao*, and Yue Hu, Pseudo-labeling based semi-supervised learning for signal integrity analysis of high-bandwidth memory (HBM) interposer, IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 6, pp. 2056-2064, December 2024

Cheng-Hao Yu, Hui Yang, Hao-Min Guo, Wen-Sheng Zhao*, Xiao-Dong Wu, Xin Tan, Yan Liu, Yun-Cheng Han, and Lei Ren, Research of single-event burnout in P-NiO/n-Ga2O3 heterojunction diode, IEEE Transactions on Device and Materials Reliability, vol. 24, no. 4, pp. 480-486, December 2024.

Jia-Hao Pan, Qi Qiang Liu, Wen-Sheng Zhao*, Xiaoping Hu, Bin You, Yue Hu, Jing Wang, Chenghao Yu, and Da-Wei Wang, Proximal policy optimization based optimization of microwave planar resonators, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 14, no. 12, pp. 2339-2347, December 2024

Xiao-Pei Zhou, Da-Wei Wang*, Wen-Sheng Zhao*, Peng Zhang, and Jia-Hao Pan, Modeling of through-silicon capacitor and its applications for the optimization of power distribution network in 3-D integrated circuits, IEEE Transactions on Signal and Power Integrity, vol. 3, pp. 199-211, December 2024

Yidan Zhang, Junchao Wang, Jinkai Chen, Guodong Su, Wen-Sheng Zhao, and Jun Liu, Machine learning-enhanced predictive modeling for arbitrary deterministic lateral displacement design and test, IEEE Transactions on NanoBioscience, vol. 24, no. 1, pp. 46-62, January 2025

Guang Chen, Wen-Jing Wu*, Wen-Sheng Zhao*, Jie Huang, and Wensong Wang, A microwave sensing system based on reflective RF oscillator and high-sensitivity coupled-line sensor for extracting real permittivity of liquid samples, IEEE Sensors Journal, vol. 25, no. 1, pp. 476-488, January 2025

Yi-Hao Ma, Da-Wei Wang, Wen-Sheng Zhao*, Cheng-Pan Huang, Bin You, Jun Liu, and Lingling Sun, A dielectric loss based absorptive common-mode filter using transmission space separation structure, IEEE Transactions on Microwave Theory and Techniques, vol. 73, no, 2, pp. 1134-1146, February 2025

Wen-Jing Wu, Hao Xie*, Wen-Sheng Zhao*, and Wensong Wang, A parallel multi-stepped impedance transmission lines (PMSITL)-based microwave measurement system for characterizing binary aqueous mixtures, IEEE Sensors Journal, vol. 25, no. 4, pp. 6309-6319, February 2025

Jia-Yi Ju, Qi Qiang Liu, Wen-Sheng Zhao*, Peng Zhang, Jing Wang*, Peng Zhao, Xuan Lin*, and Chen-Yang Yao, Distribution optimization of through-silicon via (TSV) array based on genetic algorithm, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 15, no. 2, pp. 399-409, February 2025

Peng Zhang, Da-Wei Wang, and Wen-Sheng Zhao*, A thermal and power integrity co-optimization framework for 2.5-D integrated microsystem, IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 72, no. 3, pp. 1397-1410, March 2025

Lina Shang, Guang Chen*, Wen-Jing Wu*, and Wen-Sheng Zhao*, A differential coupled-line based active microwave sensor system for retrieving real permittivity of binary aqueous solution, IEEE Access, vol. 13, pp. 50188-50200, March 2025 (Invited)

Le-Tian Wang, Da-Wei Wang*, Bo-Wen Zhang, Xiao-Feng Yang, and Wen-Sheng Zhao*, Proper orthogonal decomposition and long short-term memory neural network based multiphysics digital twin model for electronic device online condition monitoring, IEEE Transactions on Instrumentation and Measurement, vol. 74, p. 2523113, March 2025

Jun Hu, Wen-Jing Wu*, Wen-Sheng Zhao*, and Wensong Wang, An active differential microwave sensor with enhanced anti-interference capability for analyzing complex permittivity of liquid samples, IEEE Sensors Journal, vol. 25, no. 9, pp. 15043-05054, May 2025

Hao Xie, Wen-Jing Wu*, Wen-Sheng Zhao*, and Wensong Wang, A differential microwave sensor based on modified high-sensitivity substrate integrated waveguide (SIW) for detecting glucose concentration in aqueous solution, IEEE Sensors Journal, vol. 25, no. 10, pp. 16998-17010, May 2025

Cheng-Yi Feng, Lazaros Aresti, Peng Zhang, Da-Wei Wang, Wen-Sheng Zhao*, and Paul Christodoulides*, Smart cooling: Hydrogel-enhanced adaptive jet impingement utilizing through silicon via for integrated microsystems, Applied Thermal Engineering, vol. 268, p. 125895, June 2025

Wei Qi, Duo Xiao*, Hao Xie*, Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A microwave measurement system based on high-selectivity stepped impedance resonators (SIRs) for testing permittivity of dielectric materials and liquid samples, IEEE Sensors Journal, vol. 23, no. 13, pp. 24137-24151, July 2025

Da-Wei Wang, Qing Zhang, Hang Wan, and Wen-Sheng Zhao*, Finite element approach based numerical framework for device simulator, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 44, no. 8, pp. 3197-3207, August 2025

Yi-Hao Ma, Cheng-Pan Huang, Da-Wei Wang, Shuai Zhang, and Wen-Sheng Zhao*, Novel single-stage absorptive common-mode filters (A-CMFs) unit with sandwiched matching components, IEEE Transactions on Electromagnetic Compatibility, vol. 67, no. 4, pp. 1182-1191, August 2025

Cong-Jian Mai, Chang-Sheng Mao, Jia-Hao Pan, Da-Wei Wang*, Yue Hu*, Xiang Wang, and Wen-Sheng Zhao*, Reinforcement learning-based design of interconnects with reduced far-end crosstalk, IEEE Transactions on Electromagnetic Compatibility, vol. 67, no. 4, pp. 1370-1374, August 2025

Wang-Zi-Xuan Zhen, Zhong-Qing Zhang, Cheng-Hao Yu*, Hao-Min Guo, Masayuki Yamamoto, Da-Wei Wang, Bing Hong, Chun-Sheng Jiang, and Wen-Sheng Zhao*, Analysis of single-event burnout in 4H-SiC avalanche photodiode, IEEE Transactions on Device and Materials Reliability, vol. 25, no. 3, pp. 430-440, September 2025

Xiang-Ru Li, Peng Zhang, Da-Wei Wang, Jun Liu, Lingling Sun, and Wen-Sheng Zhao*, Equalizer optimization method based on local multi-constraint modeling-Bayesian optimization with region partitioning, IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 72, no. 10, pp. 5912-5925, October 2025

Wen-Bin Xie, Yi-Hao Ma, Da-Wei Wang, Cheng-Hao Yu, Yue Hu, and Wen-Sheng Zhao*, Compact single- and dual-band balanced high-selectivity bandpass filters based on microstrip resonator loaded substrate integrated waveguide, IEEE Transactions on Electromagnetic Compatibility, vol. 67, no. 6, pp. 1629-1633, October 2025

Minglong Deng, Kang Dong, Jinkai Chen*, Shurong Dong, Hao Jin, Wen-Sheng Zhao*, and Jikui Luo*, Achieving intrinsic discharge effect in contact-separation TENG by extending the theoretical model for compressible tribo-materials, Nano Energy, vol. 145, p. 111448, December 2025


Kai-Feng Li, Yi-Hao Ma, Da-Wei Wang, Wen-Yong Zhou*, Jing Wang*, and Wen-Sheng Zhao*, An ultrawideband bidirectional absorptive common-mode filter based on λ/4 coupled-line and resistive defected ground structure, IEEE Microwave and Wireless Technology Letters, 2025

Jun-Ji Chen, Wen-Jing Wu, Da-Wei Wang, Wen Sun, and Wen-Sheng Zhao*, A high-linearity planar angular displacement sensor based on dual-mode tapered ring resonator, IEEE Microwave and Wireless Technology Letters, 2025

Zhonghui Chen, Jun Hu*, Wen-Jing Wu, Wen-Sheng Zhao*, and Wensong Wang, A stepped-impedance resonators (SIRs)-based microwave measuring system for retrieving complex permittivity of liquid samples, IEEE Sensors Journal, 2025

Da-Wei Wang, Bo-Wen Zhang, Le-Tian Wang, Peng Zhang, and Wen-Sheng Zhao*, A proposal of fast thermal simulation method for 2.5-D advanced packaging to enable efficient thermal-aware placement optimization, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025

Qing-Song Fu, Da-Wei Wang, Yue Hu, Wen-Yong Zhou, Xiang Wang, Jun Liu, and Wen-Sheng Zhao*, Flexible inverse design of common-mode suppression filters with transformer network, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025

Zi-Xing Ye, Da-Wei Wang, Wen-Sheng Zhao*, Xuan Lin, Nengyong Zhu, Min Tang, Jun Liu, and Lingling Sun, Frequency domain modeling of interconnects based on assemble neural network for 3D integration, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025

Da-Wei Wang, Wei Luo, Sen-Sen Li, Lin-Yuan Chen, Cheng-Hao Yu, and Wen-Sheng Zhao*, An efficient modeling approach for electrothermal migration analysis of on-chip interconnects, IEEE Transactions on Device and Materials Reliability, 2025 

Cheng-Yi Feng, Lazaros Aresti, Peng Zhang, Wen-Sheng Zhao*, and Paul Christodoulides*, Multi-objective deep reinforcement learning driven collaborative optimization of TSV-based microchannel and PDN for 3D ICs, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025

Xiao-Yang Wu, Da-Wei Wang, and Wen-Sheng Zhao*, High-speed link system surrogate modeling and co-optimization based on multimodal machine learning and GraphVAE, IEEE Transactions on Microwave Theory and Techniques, 2025

Fei Zhou, Zi-Xing Ye, Da-Wei Wang, Wen-Yan Yin, Jun Liu, and Wen-Sheng Zhao*, Machine learning-assisted broadband S-parameter frequency-domain extrapolation method, IEEE Transactions on Microwave Theory and Techniques, 2025


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