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Yangjiahua

School of Communication Engineering

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Resume

    Dr. Jiahua Yang is currently a specially appointed associate professor at the university. He graduated with a Ph.D. from Xiamen University in June 2023 and subsequently worked as an assistant researcher at the Hong Kong University of Science and Technology (Guangzhou). His research interests include fiber optic sensing, distributed fiber optic sensing, fiber optic battery sensing, and laser technology and applications. To date, he has published nine papers in journals and conferences such as the Journal of Lightwave Technology, IEEE Sensors Journal, and IEEE Photonics Technology Letters. 

Education
Work Experience

(1) January 2024 – Present, Specially Appointed Associate Professor, School of Communication Engineering, Hangzhou Dianzi University

(2) September 2023 – December 2023, Assistant Researcher, Department of Sustainable Energy and Environment, Hong Kong University of Science and Technology (Guangzhou)


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Courses
Open Course
Patent
Publications

l  Journal Papers:

[1]. J. Yang, R. Yang, and X. Dong*, Multipoint Gas Detection Based on Intrapulse Absorption Spectroscopy, IEEE Photonics Technology Letters, vol. 35, no. 20, pp. 1086-1089, 2023.

[2]. J. Yang, H. Lin, A. He, and X. Dong*, Cascaded high-density multipoint gas detection with branched gas chambers, Measurement, vol. 205, p. 112233, 2022/12/01/ 2022.

[3]. J. Yang and X. Dong*, Multipoint Gas Detection Based on Photothermal Effect and Wavelength-Division Multiplexing (WDM) Interferometer, IEEE Sensors Journal, vol. 22, no. 20, pp. 19879-19885, 2022.

[4]. J. Yang, B. Yin, X. Dong*, W. Huang, and Y. Zou*, “Ultrasensitive Cryogenic Temperature Sensor Based on a Metalized Optical Fiber Fabry-Perot Interferometer,” Journal of Lightwave Technology, vol. 40, no. 16, pp. 5729-5735, 2022.

[5]. Y. Guan, J. Yang, B. Yin, and X. Dong*, Study of the Sensitivity Limit of Vernier Effect and a Novel Tracking Method of Vernier Envelope, IEEE Photonics Technology Letters, vol. 35, no. 2, pp. 77-80, 2023.



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