刘其强

主持项目：

1.  浙江省自然科学基金, 青年项目, 高功率器件多物理场耦合模型降阶与高效混合算法研究, 2025-01至2026-12, 10, 在研, 主持

2.  浙江省属高校基本科研业务费项目, 青年支持专项, 先进封装多物理场耦合建模与高效算法研究, 2025-03至2026-12, 5, 在研, 主持

参与项目：

1.  国家重点研发计划, 政府间国际科技创新合作项目, 集成微系统跨尺度多物理场高性能计算方法研究, 2025-05至2027-07, 200, 在研, 参与

2.  国家自然科学基金委员会, 区域创新发展联合基金项目, SiC功率芯片三维集成封装关键技术与可靠性预测研究, 2025-01至2028-12, 262, 在研, 参与

3.  国家自然科学基金委员会, 国家重点研发计划, 青年科学家项目, 纳米光电芯片EDA建模计算与超高维设计空间优化方法研究, 2026-01至2028-12, 250, 在研, 参与

主要学术论文：

[1]  Q. Q. Liu, J. Li, H. Li, S. Zhang, A. E. Ezugwu, & W. -S. Zhao*, An accuracy-preserving multiphysics FETI-DP framework for electromagneto-thermo-mechanical analysis[J]. IEEE Transactions on Microwave Theory and Techniques, vol. 74, no. 6, pp. 5068–5082, June 2026. (中科院TOP)

[2]  Q. Q. Liu, H. Li, S. Zhang, A. E. Ezugwu, & W. -S. Zhao*, A multiphysics domain decomposition method for transient electro-thermo-mechanical analysis[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 16, no. 8, pp. 1742-1753, Aug. 2026.

[3]  Q. Q. Liu, J. -H. Zhou, D. -W. Wang, A. E. Ezugwu, & W. -S. Zhao*, A mixed-order tetrahedral spectral element method for nonlinear electro-thermal bidirectional coupling in semiconductor devices[J]. Chinese Journal of Electronics, vol. 35, no. 4, pp. 1577-1588, July 2026.

[4]  Q. Q. Liu, H. Li, S. Zhang, A. E. Ezugwu, & W. -S. Zhao*, A domain decomposition method for transient electro-thermal co-simulation of DC IR-drop analysis in integrated interconnects[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2026. doi: 10.1109/TCPMT.2026.3666878

[5]  Q. Q. Liu, W. -S. Zhao*, H. Wang, & N. Feng*, 3-D domain decomposition method with nonconformal meshes for thermoelastic modeling[J]. IEEE Geoscience and Remote Sensing Letters, vol. 21, pp. 1–5, 2024.

[6]  Q. Q. Liu, M. Zhuang, W. Zhan, L. Shi, & Q. H. Liu*, A hybrid implicit-explicit discontinuous Galerkin spectral element time domain (DG-SETD) method for computational elastodynamics[J]. Geophysical Journal International, vol. 234, no. 3, pp. 1855–1869, Sep. 2023. (领域权威期刊)

[7]  Q. Q. Liu, M. Zhuang, W. Zhan, N. Liu, & Q. H. Liu*, An efficient thin layer equivalent technique of SETD method for thermo-mechanical multi-physics analysis of electronic devices[J]. International Journal of Heat and Mass Transfer, vol. 192, no. 15, pp. 122816, Aug. 2022. (中科院TOP)

[8]  N. Feng, H. Li, Z. Huang, J. Xu, & Q. Q. Liu*, Time-efficient SETI-DP implementation with termination of high-order nearly perfectly matched layer for solving elastic wave problems[J]. IEEE Transactions on Antennas and Propagation, vol. 74, no. 8, pp. 7408–7423, Aug. 2026. (中科院TOP)

[9]  J. Li, Q. Q. Liu, Z. Guan, & F. Han*, Hybrid electromagnetic reconstruction of multiple 2-D subsurface inhomogeneous objects based on FRTM and FEBI-LM methods enhanced by domain decomposition[J]. IEEE Transactions on Antennas and Propagation, vol. 73, no. 12, pp. 10757–10768, Dec. 2025. (中科院TOP)

[10] N. Feng, H. Li, Z. Huang, & Q. Q. Liu*, A nonconformal SETI-DP method for transient thermal simulation[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 9, pp. 1902–1911, Sept. 2025.

[11] N. Feng, S. Zhang, Z. Huang, & Q. Q. Liu*, A tetrahedral spectral element method for thermo-mechanical analysis of electronic devices[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 9, pp. 1932–1944, Sept. 2025.

[12] J. -H. Fu, W. -J. Wu*, Q. Q. Liu*, & W. -S. Zhao*, Microwave microfluidic sensor based on spoof localized surface plasmons for monitoring lubricating oil quality[J]. IEEE Microwave and Wireless Technology Letters, vol. 34, no. 11, pp. 1305–1308, Nov. 2024.