王大伟

王大伟，副教授，博士生导师。

研究领域聚焦射频器件-互连-集成芯片分层级与跨层级多物理建模仿真及可靠性评估等EDA关键技术，已在相关领域重要期刊发表SCI论文80余篇，授权国家发明专利20余项、软件著作权10余项，参与制定团体行业标准3项。

主持主持国家基金青年基金C类/重大研究计划培育项目、浙江省基金重大项目、国家重点实验室开放课题、ZF预研基金子课题、浙江省属高校一般项目以及校企合作横向项目，浙江省基金重大项目、JKW 1x3基金等参研单位负责人；作为研究骨干参与国家重点研发计划、国家自然基金联合基金重点、KGJ xxx工业软件、浙江省重点研发计划等多个项目技术攻关。

指导研究生一作发表科研论文30余篇、申请并授权发明专利10余项，参加ACES-China 2023、第三届/第四届全国集成微系统建模与仿真学术交流大会等学术会议并获得优秀学生论文奖；指导研究生参加中国研究生创“芯”大赛、全国先进计算技术创新大赛，荣获一等奖4项、二等奖1项、三等奖3项；指导研究生申报科研项目，获批研究生科研创新基金项目5项、浙江省教育厅一般科研项目3项；获评2024年电子信息学院育人突出个人。

Email:davidw.zoeq@hdu.edu.cn

办公地址：杭州市钱塘区2号大街1158号杭州电子科技大学下沙校区4教106室

2025.01-至今，杭州电子科技大学，电子信息学院，副教授、博士生导师

2020.01-2024.12，杭州电子科技大学，电子信息学院，副研究员、硕士生导师

IEEE会员

中国电子学会会员

《固体电子学研究与进展》青年编委

Micromachines期刊Guest Editor

Semiconductors and Heterogeneous Integration期刊Editorial Board Member

微纳器件、三维集成、多物理建模、多物理虚拟测试、可靠性分析等

[1] Da-Wei Wang, Bo-Wen Zhang, Le-Tian Wang, Haogang Wang, Wen-Sheng Zhao, “Data-driven non-intrusive reduced-order modeling framework for multiphysics digital twin models of large-scale electronic devices,” Chinese Journal of Electronics, vol. 35, no. 1, pp. 1-17, 2025.

[2] Da-Wei Wang, Bo-Wen Zhang, Le-Tian Wang, Peng Zhang, Wen-Sheng Zhao, “A proposal of fast thermal simulation method for 2.5-D advanced packaging to enable efficient thermal-aware placement optimization,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2025.

[3] Da-Wei Wang, Qing Zhang, Hang Wan, Wen-Sheng Zhao, “Finite element approach based numerical framework for device simulator,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 44, no. 8, pp. 3197-3207, 2025.

[4] Da-Wei Wang, Jia-He Zhu, Yi-Fan Liu, Gaofeng Wang, Wen-Sheng Zhao, “Modeling and Simulation of RRAM With Carbon Nanotube Electrode,” IEEE Transactions on Nanotechnology, vol. 23, pp. 1-8, 2024.

[5] Da-Wei Wang, Meng-Jian Yuan, Jia-Yun Dai, and Wen-Sheng Zhao, “Electrical Modeling and Characterization of Graphene-Based On-Chip Spiral Inductors,” Micromachines, vol. 13, no. 11, pp. 1829, Oct. 2022.

[6] Da-Wei Wang, Wen-Sheng Zhao, Zheng-Min Zhang, Qi Liu, Hao Xie, Wenchao Chen, Wen-Yan Yin, and Gaofeng Wang, “A hybrid streamline upwind finite volume-finite element method for semiconductor continuity equations,” IEEE Transactions on Electron Devices, vol. 68, no. 11, pp. 5421-5429, 2021.

[7] Da-Wei Wang, Wen-Sheng Zhao, Wenchao Chen, Hao Xie, and Wen-Yan Yin, “Fully coupled electrothermal simulation of resistive random access memory (RRAM) array,” Science China Information Science, vol. 63, no. 8, pp. 189401, 2020.

[8] Da-Wei Wang, Wen-Sheng Zhao, Wenchao Chen, Guodong Zhu, Hao Xie, Pingqi Gao, and Wen-Yan Yin, “Parallel simulation of fully coupled electrothermal processes in large-scale phase-change memory arrays,” IEEE Transactions on Electron Devices, vol. 66, no. 12, pp. 5117-5125, Dec. 2019.

[9] Da-Wei Wang, Wen-Sheng Zhao, Rui-Zhen Wang, Wen-Chao Chen, and Wen-Yan Yin, “Terahertz frequency selective surface based on metal-graphene structure with independent frequency tuneability,” IET Microwave-Antennas and Propagation, vol. 13, no. 7, pp. 911-916, Jun. 2019.

[10] Da-Wei Wang, Wenchao Chen, Wen-Sheng Zhao, Guo-Dong Zhu, Zhen-Guo Zhao, Jose E. Schutt-Aine and Wen-Yan Yin, “An improved algorithm for drift diffusion transport and its application on large scale parallel simulation of resistive random access memory arrays,” IEEE Access, vol. 7, no. 1, pp. 31273-31285, Mar. 2019.

[11] Da-Wei Wang, Wenchao Chen, Wen-Sheng Zhao, Guo-Dong Zhu, Kai Kang, Pingqi Gao, Jose E. Schutt-Aine and Wen-Yan Yin, “       ,” IEEE Access, vol. 7, pp. 3897-3908, Dec. 2018.

[12] Da-Wei Wang, Wen-Sheng Zhao, Hao Xie, Jun Hu, Liang Zhou, Wenchao Chen, Pingqi Gao, Jichun Ye, Yang Xu, Hong-Sheng Chen, Er-Ping Li and Wen-Yan Yin, “Tunable THz multiband frequency-selective surface based on hybrid metal-graphene structures,” IEEE Transactions on Nanotechnology, vol. 16, no. 6, pp. 1132-1137, Nov. 2017.

[13] Da-Wei Wang, Wen-Sheng Zhao, Xiao-Qiang Gu, Wen-Chao Chen, and Wen-Yan Yin, “Wideband modeling of graphene-based structures at different temperatures using hybrid FDTD method,” IEEE Transactions on Nanotechnology, vol. 14, no. 2, pp. 250-258, 2015.

[14] Peng Zhang, Da-Wei Wang^#, Wen-Sheng Zhao, Bin You, Jun Liu, Cheng Qian, and Hong Bo Xu, “Intelligent Design and Tuning Method for Embedded Thermoelectric Cooler (TEC) in 3D Integrated Microsystems,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 788-797, Jun. 2023.

[15] Le-Tian Wang, Da-Wei Wang*, Bo-Wen Zhang, Xiao-Feng Yang, Wen-Sheng Zhao, “Proper orthogonal decomposition and long short-term memory neural network based multiphysics digital twin model for electronic device online condition monitoring,” IEEE Transactions on Instrumentation and Measurement, vol. 74, no. 2523113, 2025.

[16] Cong-Jian Mai, Chang-Sheng Mao, Jia-Hao Pan, Da-Wei Wang*, Yue Hu*, Xiang Wang, Wen-Sheng Zhao*, “Reinforcement Learning-Based Design of Interconnects With Reduced Far-End Crosstalk,” IEEE Transactions on Electromagnetic Compatibility, 2025.

[17] Yi-Fan Liu, Da-Wei Wang*, Zhe-Kang Dong, Hao Xie, Wen-Sheng Zhao*, “Implementation of multiple-step quantized STDP based on novel memristive synapses,” IEEE Transactions on Very Large Scale Integration (VLSI) Systems, vol. 32, no. 8, pp. 1369-1379, 2024.

[18]  Wen-Bin Gao, Xuan Lin*, Guo-Sheng Li, Hong-Shun Yin, Fei-Long Lv, Peng Zhang, Da-Wei Wang*, Wen-Sheng Qian, Hao Zhang, Wen-Sheng Zhao*, “Modeling and signal integrity analysis of silicon interposer channels based on MTL and KBNN,” Microelectronics Journal, vol. 147, no. 106186, 2024.

[19]  Peng Zhang, Da-Wei Wang*, and Wen-Sheng Zhao, “Investigation on Embedded Microchannel Heatsink for 2.5-D Integrated Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 13, no. 6, pp. 838-848, Jun. 2023.

[20] Yi-Hao Ma, Da-Wei Wang*, Yufeng Yu, and Wen-Sheng Zhao, “Design of Dual-Band Frequency-Selective Surfaces with Independent Tunability,” IEEE Transactions on Antennas and Propagation, vol. 70, no. 12, pp. 12381-12386, 2022.

[21] Fu-Kang Lin, Da-Wei Wang*, Wen-Sheng Zhao*, Yufeng Yu, and Cheng Qian, “An ultrahigh-sensitivity microwave angular displacement sensor with a wide dynamic range,” Microwave and Optical Technology Letters, vol. 64, no. 10, pp. 1700-1706, May 2022.

[22] Xin-Qing Lei, Jia-He Zhu, Da-Wei Wang*, and Wen-Sheng Zhao, “Design for Ultrahigh-Density Vertical Phase Change Memory: Proposal and Numerical Investigation,” Electronics, vol. 11, no. 12, pp. 1822, Jun. 2022.

[23]  Tan-Yi Li, Wenchao Chen*, Da-Wei Wang*, Hao Xie, Qiwei Zhan, and Wen-Yan Yin, “Multiphysics Computation for Resistive Random Access Memories With Different Metal Oxides,” IEEE Transactions on Electron Devices, vol. 69, no. 1, pp. 133-140, 2022.

[24]  Bin-Xiao Wang, Wen-Sheng Zhao*, Da-Wei Wang*, Wen-Jing Wu, and Gaofeng Wang, “Sensitivity optimization of differential microwave sensors for microfluidic applications,” Sensors and Actuators A: Physical, 330: 112866, 2021.

[25] Wen-Sheng Zhao, Bin-Xiao Wang, Da-Wei Wang*, Bin You, Qi Liu, Gaofeng Wang*, “Swarm intelligence algorithm based optimal design of microwave microfluidic sensors,” IEEE Transactions on Industrial Electronics, vol. 69, no. 2, pp. 2077-2087, 2021.

[26] Peng Zhang, Da-Wei Wang*, Wen-Sheng Zhao*, Jiangtao Su, Bin You, and Jun Liu, “Multiphysics analysis and optimal design of compressible micro-interconnect for 2.5D/3D heterogeneous integration,” Electronics, vol. 10, no. 18, pp. 2240, 2021.

[27] Jia-He Zhu, Da-Wei Wang*, Wen-Sheng Zhao*, Jia-Yun Dai, and Gaofeng Wang, “A Proposal of Vertical MOSFET and Electrothermal Analysis for Monolithic 3-D ICs,”Electronics, vol. 10, no. 18, pp. 2241, 2021.

[28] Li-Chao Fan, Wen-Sheng Zhao*, Da-Wei Wang*, Qi Liu, Shichang Chen, Gaofeng Wang*, “An ultrahigh sensitivity microwave sensor for microfluidic applications,” IEEE Microwave and Wireless Components Letters, vol. 30, no. 12, pp. 1201-1204, 2020. 

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