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傅楷：电子信息学院（集成电路科学与工程学院）特聘副研究员。2025年获香港城市大学(CityUHK)博士学位，专业为电子科学与技术。毕业后进入杭州电子科技大学任教，曾于英国伯明翰大学、南方科技大学交流。 长期致力于机器学习等人工智能算法赋能的电磁器件设计研究，发表SCI论文20余篇(3篇一区TOP期刊论文)，获授权发明专利7项。 现为IEEE会员，担任IEEE TAP, IEEE AWPL, IEEE MWTL等期刊审稿人。 现为电子信息学院赵文生教授负责的三维异构集成和微系统团队成员[友情链接]。 2021.09-2025.10： 香港城市大学（CityUHK），博士。 2017.09-2020.03： 杭州电子科技大学，硕士。 2013.09-2017.06： 杭州电子科技大学，学士。 纵向科研
横向科研
论文
Journal Papers1. Kai Fu and Kwok Wa Leung. “NeuroStorm: An Adaptive Neural-Network-Driven Algorithm for Mixed-Variable Antenna Design,” IEEE Transactions on Antennas and Propagation, 2025, IF=5.8, JCR Q1. 2. Kai Fu and Kwok Wa Leung. “Machine-Learning-Assisted Swarm Intelligence Algorithm for Antenna Optimization with Mixed Continuous and Binary Variables,” IEEE Transactions on Antennas and Propagation, 2024, IF=5.8, JCR Q1. 3. Kai Fu, et al. “An Efficient Surrogate Assisted Particle Swarm Optimization for Antenna Synthesis,” IEEE Transactions on Antennas and Propagation, 2022, IF=5.8, JCR Q1. 4. Kai Fu, et al. “Analysis of Transmission Characteristics of Copper/Carbon Nanotube Composite Through-Silicon Via Interconnects,” Chin J. Electron., 2019, IF=1.6, JCR Q3. 5. Kai Fu, et al. “A Passive Equalizer Design for Shielded Differential Through-Silicon Vias in 3-D ICs,” IEEE Microw. Wireless Compon. Lett., 2018, IF=2.9, JCR Q2. 6. Kai Fu, et al. “Compact Passive Equalizer Design for Differential Channels in TSV-based 3-D ICs,” IEEE Access, 2018, IF=3.4, JCR Q2. 7. Kai Fu, et al. “Modeling and Performance Analysis of Shield Differential Annular Through-Silicon Via (SD-ATSV) for 3-D ICs,” IEEE Access, 2018, IF=3.4, JCR Q2. 8. W.-S. Zhao, Kai Fu, et al. “Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects,” Applied Sciences, 2019, IF=2.5, JCR Q2. 9. J.-W. Pan, Kai Fu, et al. “Modelling of Crosstalk in Differential TSVs for 3-D ICs,” IET Microwaves Antennas & Propagation, 2019, IF=1.1, JCR Q4. 10. W.-S. Zhao, Q.-H. Hu, Kai Fu, et al. “Electrical Modeling of Carbon Nanotube-based Shielded Through-Silicon Vias for Three-Dimensional Integrated Circuits,” Int J Numer Model Electron Netw Devices Fields, 2021, IF=1.6, JCR Q3. 11. W.-S. Zhao, Q.-H. Hu, Kai Fu, et al. “On the Applicability of Two-Bit Carbon Nanotube Through-Silicon Via for Power Distribution Networks in 3D Integrated Circuits,” IET Circuits, Devices & Systems, 2021, IF=1.0, JCR Q4. 12. W.-S. Zhao, Q.-H. Hu, Kai Fu, et al. “Modeling of Carbon Nanotube-Based Differential Through-Silicon Vias in 3-D ICs,” IEEE Trans. on Nanotechnol., 2020, IF=2.1, JCR Q3. 13. Q.-H. Hu, W.-S. Zhao, Kai Fu, et al. “Modeling and Characterization of Differential Multi-Bit Carbon Nanotube Through-Silicon Vias,” IEEE Trans. Compon. Packag. Manuf. Technol., 2020, IF=2.3, JCR Q3. 14. W.-S. Zhao, Z.-H. Cheng, J. Wang, Kai Fu, et al. “Vertical Graphene Nanoribbon Interconnects at the End of the Roadmap,” IEEE Trans. Electron Devices, 2018, IF=2.9, JCR Q2. Conference Proceedings1. Kai Fu, et al. “Surrogate-Assisted PSO for Patch Antenna Designs,” 2024 IEEE Conference on Antenna Measurements and Applications, 2024, Danang, Vietnam. 2. Kai Fu, et al. “A Machine Learning Enhanced Evolutionary Algorithm for Antenna Design,” 2023 IEEE Conference on Antenna Measurements and Applications, 2023, Genoa, Italy. 3. Kai Fu, et al. “The Impact of Current Return Path on the Signal Propagation in the Through-Silicon Via Array,” 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2017, Haining, China. 著作
1.赵文生，傅楷，等，针对差分硅通孔传输通道的无源均衡器及其设计方法， 2022年 2.赵文生，傅楷，等，针对屏蔽差分硅通孔的RL无源均衡器结构及其设计方法， 2022年 3.赵文生，傅楷，等，针对屏蔽差分硅通孔的RC无源均衡器结构及其设计方法，2022年 4.赵文生，傅楷，等，运用硅通孔结构的新型切皮雪夫滤波器，2018年 5.赵文生，胡庆豪，傅楷，等，一种屏蔽差分多比特硅通孔结构及其制备方法， 2022年 6.赵文生，胡庆豪，傅楷，等，一种差分多比特硅通孔结构及其制备方法， 2022年 |